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ORCIDHouman Zahedmanesh
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2020 – today
- 2024
[c12]O. Varela Pedreira, Youqi Ding, D. Coenen, Philippe Roussel, A. S. Saleh, Veerle Simons, Houman Zahedmanesh, Ivan Ciofi, Kris Croes:
De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. IRPS 2024: 1-5- 2023
- [c11]Youqi Ding
, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes:
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS 2023: 1-7 - [c10]A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes:
Impact of via geometry and line extension on via-electromigration in nano-interconnects. IRPS 2023: 1-4 - [c9]Houman Zahedmanesh, Philippe Roussel, Ivan Ciofi, Kristof Croes:
A pragmatic network-aware paradigm for system-level electromigration predictions at scale. IRPS 2023: 1-6 - [c8]Olalla Varela Pedreira, Houman Zahedmanesh, Youqi Ding, Ivan Ciofi, Kristof Croes:
Challenges for Interconnect Reliability: From Element to System Level. ISPD 2023: 106 - 2022
- [j3]Mahta Mayahinia, Mehdi B. Tahoori, Manu Perumkunnil Komalan, Houman Zahedmanesh, Kristof Croes, Tommaso Marinelli, José Ignacio Gómez Pérez, Timon Evenblij, Gouri Sankar Kar, Francky Catthoor:
Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(12): 5327-5332 (2022) - [c7]Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Kristof Croes, Mustafa Badaroglu:
System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents. IRPS 2022: 1-7 - [c6]O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes:
Assessment of critical Co electromigration parameters. IRPS 2022: 8 - 2021
- [c5]Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes:
Electromigration limits of copper nano-interconnects. IRPS 2021: 1-6 - [c4]Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Mustafa Badaroglu, Kristof Croes:
A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network. SLIP 2021: 1-7 - 2020
- [c3]Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi B. Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor:
Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects. IRPS 2020: 1-5
2010 – 2019
- 2019
- [c2]Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi Baradaran Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor:
Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects. IRPS 2019: 1-6 - 2018
- [c1]Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne:
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS 2018: 4 - 2016
- [j2]Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei:
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. Microelectron. Reliab. 59: 102-107 (2016)
2000 – 2009
- 2009
- [j1]Houman Zahedmanesh, Caitríona Lally:
Determination of the influence of stent strut thickness using the finite element method: implications for vascular injury and in-stent restenosis. Medical Biol. Eng. Comput. 47(4): 385-393 (2009)
Coauthor Index
aka: Kristof Croes
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