"Thermomigration-induced void formation in Cu-interconnects - Assessment of ..."

Youqi Ding et al. (2023)

> Home

Details and statistics

DOI: 10.1109/IRPS48203.2023.10117870

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/irps/DingPLZCFWC23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/irps/DingPLZCFWC23
Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes:
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS 2023: 1-7

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.