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ORCIDJaemin Lim
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2020 – today
- 2024
[c8]Jaemin Lim, Kiyeon Kim:
Wav2vec-VC: Voice Conversion via Hidden Representations of Wav2vec 2.0. ICASSP 2024: 10326-10330- 2022
- [c7]Jaemin Lim, Kiyeon Kim, Hyunwoo Yu, Suk-Bok Lee:
Overo: Sharing Private Audio Recordings. CCS 2022: 1933-1946 - 2020
- [j2]Jaemin Lim
, Kiyeon Kim, Hyunwoo Yu, Suk-Bok Lee:
Making Connected Cars Untraceable via DSRC Radios. IEEE Access 8: 224932-224946 (2020)
2010 – 2019
- 2018
- [c6]Hyunwoo Yu, Jaemin Lim, Kiyeon Kim, Suk-Bok Lee:
Pinto: Enabling Video Privacy for Commodity IoT Cameras. CCS 2018: 1089-1101 - 2017
- [j1]Jaemin Lim, Hyunwoo Yu, Kiyeon Kim, Minho Kim, Suk-Bok Lee:
Preserving Location Privacy of Connected Vehicles With Highly Accurate Location Updates. IEEE Commun. Lett. 21(3): 540-543 (2017) - [c5]Minho Kim, Jaemin Lim, Hyunwoo Yu, Kiyeon Kim, Younghoon Kim, Suk-Bok Lee:
ViewMap: Sharing Private In-Vehicle Dashcam Videos. NSDI 2017: 163-176 - 2015
- [c4]Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Sumin Choi, Jaemin Lim, Joungho Kim:
Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. 3DIC 2015: TS2.2.1-TS2.2.4 - [c3]Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim:
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC 2015: TS8.25.1-TS8.25.5 - [c2]Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim:
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo 2015: 212-215 - [c1]Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim:
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo 2015: 248-251
Coauthor Index
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