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"TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC."
Jonghoon J. Kim et al. (2015)
- Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim:
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo 2015: 212-215
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