![](https://dblp.uni-trier.de./img/logo.ua.320x120.png)
![](https://dblp.uni-trier.de./img/dropdown.dark.16x16.png)
![](https://dblp.uni-trier.de./img/peace.dark.16x16.png)
Остановите войну!
for scientists:
![search dblp search dblp](https://dblp.uni-trier.de./img/search.dark.16x16.png)
![search dblp](https://dblp.uni-trier.de./img/search.dark.16x16.png)
default search action
"Shielding structures for through silicon via (TSV) to active circuit noise ..."
Jaemin Lim et al. (2015)
- Jaemin Lim, Manho Lee
, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim:
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo 2015: 248-251
![](https://dblp.uni-trier.de./img/cog.dark.24x24.png)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.