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ORCIDSuresh K. Sitaraman
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Journal Articles
- 2019
[j9]Nitish Kumar
, Jialuo Chen, Monodeep Kar, Suresh K. Sitaraman, Saibal Mukhopadhyay, Satish Kumar:
Multigated Carbon Nanotube Field Effect Transistors-Based Physically Unclonable Functions As Security Keys. IEEE Internet Things J. 6(1): 325-334 (2019)- 2018
- [j8]Philip Y. Chung, Suresh K. Sitaraman:
Random vibration analysis of 3-Arc-Fan compliant interconnects. Microelectron. Reliab. 81: 7-21 (2018) - 2014
- [j7]Ye Tian, Xi Liu, Justin Chow, Yi-Ping Wu, Suresh K. Sitaraman:
Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies. Microelectron. Reliab. 54(5): 939-944 (2014) - 2013
- [j6]Xi Liu, Qiao Chen, Venkatesh Sundaram, Rao R. Tummala, Suresh K. Sitaraman:
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test. Microelectron. Reliab. 53(1): 70-78 (2013) - [j5]Wei Chen, Raphael Okereke, Suresh K. Sitaraman:
Compliance analysis of multi-path fan-shaped interconnects. Microelectron. Reliab. 53(7): 964-974 (2013) - 2010
- [j4]Injoong Kim, Russell S. Peak, Suresh K. Sitaraman:
ROM: a reliability knowledge representation for collaborative system design. Eng. Comput. 26(1): 11-33 (2010) - [j3]Krishna Tunga, Suresh K. Sitaraman:
Laser moiré interferometry for fatigue life prediction of lead-free solders. Microelectron. Reliab. 50(12): 2026-2036 (2010) - 2008
- [j2]Sai Zeng, Russell S. Peak, Angran Xiao, Suresh K. Sitaraman:
ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems. Eng. Comput. 24(4): 359-381 (2008) - 2007
- [j1]Andy Perkins, Suresh K. Sitaraman:
Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages. Microelectron. Reliab. 47(12): 2260-2274 (2007)
Conference and Workshop Papers
- 2018
- [c2]Jun-Yang Lei, Thomas Moon, Justin Chow, Suresh K. Sitaraman, Abhijit Chatterjee:
A Monobit Built-In Test and Diagnostic System for Flexible Electronic Interconnect. ATS 2018: 191-196 - 2011
- [c1]Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim:
Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. ICCAD 2011: 563-570
Coauthor Index
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