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Journal Articles
- 2024
[j4]Sang Woo Park
, Seul Ki Hong, Sarah Eunkyung Kim, Jong Kyung Park:
First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer. IEEE Access 12: 82396-82401 (2024)- 2014
- [j3]Junsung Ma, Sungdong Kim, Sarah Eunkyung Kim:
Characterization of flip chip bonded structure with Cu ABL power bumps. Microelectron. Reliab. 54(8): 1598-1602 (2014) - 2010
- [j2]Youngrae Kim, Sung-Keun Kang, Sarah Eunkyung Kim:
Study of thinned Si wafer warpage in 3D stacked wafers. Microelectron. Reliab. 50(12): 1988-1993 (2010) - [j1]Seok Hwan Lee, Jaeyong Sung, Sarah Eunkyung Kim:
Dynamic flow measurements of capillary underfill through a bump array in flip chip package. Microelectron. Reliab. 50(12): 2078-2083 (2010)
Conference and Workshop Papers
- 2019
- [c3]Hae-Sung Park, Han Kyeol Seo, Sarah Eunkyung Kim:
Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding. 3DIC 2019: 1-4 - [c2]Han Kyeol Seo, Hae-Sung Park, Sarah Eunkyung Kim:
Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application. 3DIC 2019: 1-4 - 2011
- [c1]Sung-Geun Kang, Youngrae Kim, Eun-Sol Kim, Naeun Lim, Teakgyu Jeong, Jieun Lee, Sarah Eunkyung Kim, Sungdong Kim:
Evaluation of wafer level Cu bonding for 3D integration. 3DIC 2011: 1-2
Coauthor Index
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