"First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With ..."

Sang Woo Park et al. (2024)

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DOI: 10.1109/ACCESS.2024.3409622

access: open

type: Journal Article

metadata version: 2024-07-04

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Sang Woo Park, Seul Ki Hong, Sarah Eunkyung Kim, Jong Kyung Park:
First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer. IEEE Access 12: 82396-82401 (2024)

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