"Evaluation of wafer level Cu bonding for 3D integration."

Sung-Geun Kang et al. (2011)

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DOI: 10.1109/3DIC.2012.6263014

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Sung-Geun Kang, Youngrae Kim, Eun-Sol Kim, Naeun Lim, Teakgyu Jeong, Jieun Lee, Sarah Eunkyung Kim, Sungdong Kim:
Evaluation of wafer level Cu bonding for 3D integration. 3DIC 2011: 1-2

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