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2010 – 2019
- 2015
[c9]Chuan-An Cheng, Ryuichi Sugie
, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen:
Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. 3DIC 2015: TS8.12.1-TS8.12.4- 2014
- [c8]Tang-Hsuan Wang, Po-Tsang Huang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, Wei Hwang:
Energy-efficient configurable discrete wavelet transform for neural sensing applications. ISCAS 2014: 1841-1844 - [c7]Po-Tsang Huang, Lei-Chun Chou, Teng-Chieh Huang, Shang-Lin Wu, Tang-Shuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Kuan-Neng Chen, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ming-Hsiang Cheng, Yueh-Lung Lin, Ho-Ming Tong:
18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications. ISSCC 2014: 320-321 - [c6]Shang-Lin Wu, Po-Tsang Huang, Teng-Chieh Huang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, Wei Hwang:
Energy-efficient low-noise 16-channel analog-front-end circuit for bio-potential acquisition. VLSI-DAT 2014: 1-4 - 2013
- [c5]Yan-Pin Huang, Ruoh-Ning Tzeng, Yu-San Chien, Ming-Shaw Shy, Teu-Hua Lin, Kuo-Hua Chen, Ching-Te Chuang, Wei Hwang, Chi-Tsung Chiu, Ho-Ming Tong, Kuan-Neng Chen:
Low temperature (<180 °C) bonding for 3D integration. 3DIC 2013: 1-5 - [c4]Teng-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, Wei Hwang:
Area-power-efficient 11-bit SAR ADC with delay-line enhanced tuning for neural sensing applications. BioCAS 2013: 238-241 - [c3]Ming-Hung Chang, Shang-Yuan Lin, Pei-Chen Wu, Olesya Zakoretska, Ching-Te Chuang, Kuan-Neng Chen, Chen-Chao Wang, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Wei Hwang:
Near-/Sub-Vth process, voltage, and temperature (PVT) sensors with dynamic voltage selection. ISCAS 2013: 133-136 - [c2]Chih-Wei Chang, Po-Tsang Huang, Lei-Chun Chou, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen-Chi Lee, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong:
Through-silicon-via-based double-side integrated microsystem for neural sensing applications. ISSCC 2013: 102-103 - 2012
- [c1]Tzu-Ting Chiang, Po-Tsang Huang, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Wei Hwang:
On-chip self-calibrated process-temperature sensor for TSV 3D integration. SoCC 2012: 370-375
Coauthor Index
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