"On-chip self-calibrated process-temperature sensor for TSV 3D integration."

Tzu-Ting Chiang et al. (2012)

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DOI: 10.1109/SOCC.2012.6398338

access: closed

type: Conference or Workshop Paper

metadata version: 2017-09-16

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Tzu-Ting Chiang, Po-Tsang Huang, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Wei Hwang:
On-chip self-calibrated process-temperature sensor for TSV 3D integration. SoCC 2012: 370-375

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