"Low temperature (<180 °C) bonding for 3D integration."

Yan-Pin Huang et al. (2013)

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DOI: 10.1109/3DIC.2013.6702319

access: closed

type: Conference or Workshop Paper

metadata version: 2017-09-16

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Yan-Pin Huang, Ruoh-Ning Tzeng, Yu-San Chien, Ming-Shaw Shy, Teu-Hua Lin, Kuo-Hua Chen, Ching-Te Chuang, Wei Hwang, Chi-Tsung Chiu, Ho-Ming Tong, Kuan-Neng Chen:
Low temperature (<180 °C) bonding for 3D integration. 3DIC 2013: 1-5

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