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Vincent Bley
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2020 – today
- 2023
- [j7]Baptiste Arati, Vincent Bley, Pierre-Yves Pichon, Gilbert Teyssedre:
New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications. IEEE Access 11: 133967-133978 (2023)
2010 – 2019
- 2018
- [j6]Morgane Mousnier, Kévin Sanchez, Elsa Locatelli, Thierry Lebey, Vincent Bley:
Lock-in thermography for defect localization and thermal characterization for space application. Microelectron. Reliab. 88-90: 67-74 (2018) - [c2]Cyril Buttay, Raphel Riva, Bruno Allard, Marie-Laure Locatelli, Vincent Bley:
Packaging with Double-Side Cooling Capability for SiC Devices, Based on Silver Sintering. IECON 2018: 5753-5759 - 2017
- [j5]Hayet Kharbouch, Azzedine Hamid, Thierry Lebey, Vincent Bley, Léon Havez, Celine Combette:
Using the variable width in a planar inductor on Kapton for optimizing its performance. Turkish J. Electr. Eng. Comput. Sci. 25: 3798-3810 (2017) - 2016
- [j4]A. Bensaci, Azzedine Hamid, A. Flitti, Thierry Lebey, Vincent Bley, Fatima Zohra Medjaoui:
Design of a New Electrical Model of Integrated LC Filter in DC-DC Converter. J. Low Power Electron. 12(1): 35-44 (2016) - 2015
- [j3]A. Allaoui, Azzedine Hamid, Pierre Spitéri, Vincent Bley, Thierry Lebey:
Thermal Modeling of an Integrated Inductor in a Micro-Converter. J. Low Power Electron. 11(1): 63-73 (2015) - [j2]Nicolas Courjault, Philippe Perdu, Fulvio Infante, Thierry Lebey, Vincent Bley:
Magnetic imaging for resistive, capacitive and inductive devices; from theory to piezo actuator failure localization. Microelectron. Reliab. 55(9-10): 1622-1627 (2015) - 2014
- [c1]Olivier Goualard, Nicolas Videau, Thierry Meynard, Thi Bang Doan, Thierry Lebey, Vincent Bley, Emmanuel Sarraute:
Integrated dc-dc based-GaN converter with screen printed capacitors allowing double side cooling. IECON 2014: 1549-1555 - 2012
- [j1]Zhifeng Dou, Frédéric Richardeau, Emmanuel Sarraute, Vincent Bley, Jean-Marc Blaquière, Claire Vella, Gilles Gonthier:
PCB dual-switch fuse with energetic materials embedded: Application for new fail-safe and fault-tolerant converters. Microelectron. Reliab. 52(9-10): 2457-2464 (2012)
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