"Packaging with Double-Side Cooling Capability for SiC Devices, Based on ..."

Cyril Buttay et al. (2018)

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DOI: 10.1109/IECON.2018.8591117

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-21

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Cyril Buttay, Raphel Riva, Bruno Allard, Marie-Laure Locatelli, Vincent Bley:
Packaging with Double-Side Cooling Capability for SiC Devices, Based on Silver Sintering. IECON 2018: 5753-5759

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