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ORCIDLei Su 0002
Person information
- affiliation: Jiangnan University, Jiangsu Key Laboratory of Advanced Food Manufacturing Equipment and Technology, Wuxi, China
- affiliation (Ph.D., 2015): Huazhong University of Science and Technology, Wuhan, China
Other persons with the same name
- Lei Su — disambiguation page
- Lei Su 0001
![[0000-0001-8728-0583]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0001-8728-0583")
— Anhui University of Technology, School of Electrical and Information Engineering, Ma'anshan, China (and 1 more) - Lei Su 0003 — Kunming University of Science and Technology, School of Information and Automation, China
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2020 – today
- 2024
[j20]Yu Sun, Lei Su, Jiefei Gu, Xinwei Zhao, Ke Li, Michael G. Pecht:
Flip-chip solder bumps defect detection using a self-search lightweight framework. Adv. Eng. Informatics 60: 102395 (2024)- [j19]Siyu Zhang, Lei Su, Jiefei Gu, Ke Li, Weitian Wu, Michael G. Pecht:
Category-level selective dual-adversarial network using significance-augmented unsupervised domain adaptation for surface defect detection. Expert Syst. Appl. 238(Part B): 121879 (2024) - [j18]Yu Sun, Lei Su, Jiefei Gu, Xinwei Zhao, Ke Li, Michael G. Pecht:
Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection. IEEE Trans. Ind. Informatics 20(8): 10134-10144 (2024) - 2023
- [j17]Yu Sun, Lei Su, Jiefei Gu, Ke Li, Michael G. Pecht:
A Novel Three-Probability Spaces Logic Decoupling Distillation for Flip-Chip Defect Detection. IEEE Trans. Instrum. Meas. 72: 1-10 (2023) - 2021
- [j16]Lei Su, Xiaonan Yu, Ke Li, Jiefei Gu, Michael G. Pecht:
Sparse Reconstruction for Microdefect Detection of Two-Dimensional Ultrasound Image Based on Blind Estimation. IEEE Trans. Ind. Electron. 68(10): 10154-10161 (2021) - 2020
- [j15]Libo Zhao, Zhenzhi He, Zengxiang Wang, Lei Su, Xiangning Lu:
Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls. IEEE Trans. Ind. Informatics 16(3): 1617-1624 (2020)
2010 – 2019
- 2019
- [j14]Lei Su, Xiaonan Yu, Ke Li, Xingyan Yao, Michael G. Pecht:
Simulation and Experimental Verification of Edge Blurring Phenomenon in Microdefect Inspection Based on High-Frequency Ultrasound. IEEE Access 7: 11515-11525 (2019) - [j13]Ke Li, Rui Zhang, Fucai Li, Lei Su, Huaqing Wang, Peng Chen:
A New Rotation Machinery Fault Diagnosis Method Based on Deep Structure and Sparse Least Squares Support Vector Machine. IEEE Access 7: 26571-26580 (2019) - [j12]Xingyan Yao, Saurabh Saxena, Lei Su, Michael G. Pecht:
The Explosive Nature of Tab Burrs in Li-Ion Batteries. IEEE Access 7: 45978-45982 (2019) - [j11]Ke Li, Meng Xiong, Fucai Li, Lei Su, Jingjing Wu:
A novel fault diagnosis algorithm for rotating machinery based on a sparsity and neighborhood preserving deep extreme learning machine. Neurocomputing 350: 261-270 (2019) - 2018
- [j10]Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su:
Using GA-SVM for defect inspection of flip chips based on vibration signals. Microelectron. Reliab. 81: 159-166 (2018) - [j9]Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi:
Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm. IEEE Trans. Ind. Informatics 14(12): 5620-5628 (2018) - 2017
- [j8]Hongdi Zhou, Tielin Shi, Guanglan Liao, Jianping Xuan, Jie Duan, Lei Su, Zhenzhi He, Wuxing Lai:
Weighted Kernel Entropy Component Analysis for Fault Diagnosis of Rolling Bearings. Sensors 17(3): 625 (2017) - [j7]Ke Li, Jingjing Wu, Qiuju Zhang, Lei Su, Peng Chen:
New Particle Filter Based on GA for Equipment Remaining Useful Life Prediction. Sensors 17(4): 696 (2017) - 2016
- [j6]Junjie Shen, Pengfei Chen, Lei Su, Tielin Shi, Zirong Tang, Guanglan Liao:
X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm. Microelectron. Reliab. 67: 129-134 (2016) - [j5]Yichun Zhang, Tielin Shi, Lei Su, Xiao Wang, Yuan Hong, Kepeng Chen, Guanglan Liao:
Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging. Sensors 16(10): 1773 (2016) - 2015
- [j4]Lei Su, Tielin Shi, Li Du, Xiangning Lu, Guanglan Liao:
Genetic algorithms for defect detection of flip chips. Microelectron. Reliab. 55(1): 213-220 (2015) - [j3]Guanglan Liao, Li Du, Lei Su, Miao Zeng, Lei Nie, Tielin Shi:
Using RBF networks for detection and prediction of flip chip with missing bumps. Microelectron. Reliab. 55(12): 2817-2825 (2015) - [j2]Guanglan Liao, Pengfei Chen, Li Du, Lei Su, Zhiping Liu, Zirong Tang, Tielin Shi:
Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration. Microelectron. Reliab. 55(12): 2826-2832 (2015) - 2013
- [j1]Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao:
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer. Sensors 13(12): 16281-16291 (2013)
Coauthor Index
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