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2020 – today
- 2024
[j16]Ye Jiang
, Zhiyong Liu, Guanglan Liao, Bo Ma:
A Novel Chip-on-Board Defect Detection Approach Combining Infrared Thermal Evolution and Self-Supervised Transformer. IEEE Trans. Ind. Informatics 20(5): 8044-8054 (2024)- 2022
- [j15]Jian Duan, Cheng Hu, Xiaobin Zhan, Hongdi Zhou, Guanglan Liao, Tielin Shi:
MS-SSPCANet: A powerful deep learning framework for tool wear prediction. Robotics Comput. Integr. Manuf. 78: 102391 (2022)
2010 – 2019
- 2018
- [j14]Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su:
Using GA-SVM for defect inspection of flip chips based on vibration signals. Microelectron. Reliab. 81: 159-166 (2018) - [j13]Kepeng Chen, Tielin Shi, Qiang Liu, Zirong Tang, Guanglan Liao:
Microscopic Three-Dimensional Measurement Based on Telecentric Stereo and Speckle Projection Methods. Sensors 18(11): 3882 (2018) - [j12]Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi:
Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm. IEEE Trans. Ind. Informatics 14(12): 5620-5628 (2018) - 2017
- [j11]Hongdi Zhou, Tielin Shi, Guanglan Liao, Jianping Xuan, Jie Duan, Lei Su, Zhenzhi He, Wuxing Lai:
Weighted Kernel Entropy Component Analysis for Fault Diagnosis of Rolling Bearings. Sensors 17(3): 625 (2017) - [j10]Xiao Wang, Tielin Shi, Guanglan Liao, Yichun Zhang, Yuan Hong, Kepeng Chen:
Using Wavelet Packet Transform for Surface Roughness Evaluation and Texture Extraction. Sensors 17(4): 933 (2017) - 2016
- [j9]Junjie Shen, Pengfei Chen, Lei Su, Tielin Shi, Zirong Tang, Guanglan Liao:
X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm. Microelectron. Reliab. 67: 129-134 (2016) - [j8]Yichun Zhang, Tielin Shi, Lei Su, Xiao Wang, Yuan Hong, Kepeng Chen, Guanglan Liao:
Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging. Sensors 16(10): 1773 (2016) - [c9]Zhuyun Chen, Xueqiong Zeng, Weihua Li, Guanglan Liao:
Machine fault classification using deep belief network. I2MTC 2016: 1-6 - 2015
- [j7]Lei Su, Tielin Shi, Li Du, Xiangning Lu, Guanglan Liao:
Genetic algorithms for defect detection of flip chips. Microelectron. Reliab. 55(1): 213-220 (2015) - [j6]Guanglan Liao, Li Du, Lei Su, Miao Zeng, Lei Nie, Tielin Shi:
Using RBF networks for detection and prediction of flip chip with missing bumps. Microelectron. Reliab. 55(12): 2817-2825 (2015) - [j5]Guanglan Liao, Pengfei Chen, Li Du, Lei Su, Zhiping Liu, Zirong Tang, Tielin Shi:
Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration. Microelectron. Reliab. 55(12): 2826-2832 (2015) - 2014
- [j4]Zhensong Xu, Tielin Shi, Xiangning Lu, Guanglan Liao:
Using active thermography for defects inspection of flip chip. Microelectron. Reliab. 54(4): 808-815 (2014) - 2013
- [j3]Ke Wang, Tielin Shi, Guanglan Liao, Qi Xia:
Image registration using a point-line duality based line matching method. J. Vis. Commun. Image Represent. 24(5): 615-626 (2013) - [j2]Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao:
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer. Sensors 13(12): 16281-16291 (2013) - 2012
- [j1]Junchao Liu, Tielin Shi, Ke Wang, Zirong Tang, Guanglan Liao:
Defect detection of flip-chip solder joints using modal analysis. Microelectron. Reliab. 52(12): 3002-3010 (2012) - [c8]Qiang Yu, Jun Wang, Weijie Zhang, Guanglan Liao:
Finite element analysis on the micro-forming process of Zr-based bulk metallic glass. CSCWD 2012: 751-756 - 2011
- [c7]Ke Wang, Qi Xia, Tielin Shi, Guanglan Liao, Shiyuan Liu:
A pattern matching method using geometric information of images. NEMS 2011: 33-36
2000 – 2009
- 2009
- [c6]Lei Nie, Tielin Shi, Zirong Tang, Shiyuan Liu, Guanglan Liao:
Low temperature direct bonding for hermetic wafer level packaging. NEMS 2009: 472-475 - [c5]Jie Gong, Zirong Tang, Tielin Shi, Guanglan Liao, Lei Nie, Shiyuan Liu:
Improved adhesion between C-MEMS and substrate by micromechanical interlocking. NEMS 2009: 624-627 - [c4]Ping Peng, Tielin Shi, Guanglan Liao, Zirong Tang, Chang Liu:
Scratch of submicron grooves on aluminum film with AFM diamond tip. NEMS 2009: 983-986 - 2006
- [c3]Shiyuan Liu, Li Lu, Guanglan Liao, Jianping Xuan:
Pattern Discovery from Time Series Using Growing Hierarchical Self-Organizing Map. ICONIP (1) 2006: 1030-1037 - 2005
- [c2]Guanglan Liao, Tielin Shi, Shiyuan Liu, Jianping Xuan:
A Novel Technique for Data Visualization Based on SOM. ICANN (1) 2005: 421-426 - [c1]Guanglan Liao, Tielin Shi, Weihua Li, Tao Huang:
Feature Selection and Classification of Gear Faults Using SOM. ISNN (3) 2005: 556-560
Coauthor Index
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