"Low temperature direct bonding for hermetic wafer level packaging."

Lei Nie et al. (2009)

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DOI: 10.1109/NEMS.2009.5068621

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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Lei Nie, Tielin Shi, Zirong Tang, Shiyuan Liu, Guanglan Liao:
Low temperature direct bonding for hermetic wafer level packaging. NEMS 2009: 472-475

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