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Journal Articles
- 2017
[j10]Toshitaka Ishizaki
, D. Miura, A. Kuno, K. Hasegawa, Masanori Usui, Y. Yamada:
Young's modulus of a sintered Cu joint and its influence on thermal stress. Microelectron. Reliab. 76-77: 405-408 (2017)- [j9]Masanori Usui, Toshikazu Satoh, Hidehiko Kimura, S. Tajima, Y. Hayashi, Daigo Setoyama, Masashi Kato:
Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding. Microelectron. Reliab. 78: 93-99 (2017) - 2016
- [j8]Masanori Usui, Hidehiko Kimura, Toshikazu Satoh, Takashi Asada, Satoshi Yamaguchi, Masashi Kato:
Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography. Microelectron. Reliab. 63: 152-158 (2016) - [j7]Toshitaka Ishizaki, Daiki Miura, Atsuki Kuno, Ryota Nagao, Syoho Aoki, Yuta Ohshima, Takuma Kino, Masanori Usui, Yasushi Yamada:
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. Microelectron. Reliab. 64: 287-293 (2016) - 2015
- [j6]Toshitaka Ishizaki, Masashi Yanase, A. Kuno, T. Satoh, Masanori Usui, F. Osawa, Yasushi Yamada:
Thermal simulation of joints with high thermal conductivities for power electronic devices. Microelectron. Reliab. 55(7): 1060-1066 (2015) - [j5]Toshitaka Ishizaki, Masanori Usui, Y. Yamada:
Thermal cycle reliability of Cu-nanoparticle joint. Microelectron. Reliab. 55(9-10): 1861-1866 (2015) - 2011
- [j4]Takashi Asada, Yuji Yagi, Masanori Usui, T. Suzuki, Nobutada Ohno:
Warpage analysis of layered structures connected by direct brazing. Microelectron. Reliab. 51(9-11): 1836-1839 (2011) - 2006
- [j3]Masayasu Ishiko, Masanori Usui, Takashi Ohuchi, Mikio Shirai:
Design concept for wire-bonding reliability improvement by optimizing position in power devices. Microelectron. J. 37(3): 262-268 (2006) - 2005
- [j2]Masanori Usui, Masayasu Ishiko, Koji Hotta, Satoshi Kuwano, Masato Hashimoto:
Effects of uni-axial mechanical stress on IGBT characteristics. Microelectron. Reliab. 45(9-11): 1682-1687 (2005) - 2002
- [j1]Masanori Usui, Takahide Sugiyama, Masayasu Ishiko, Jun Morimoto, Hirokazu Saitoh, Masaki Ajioka:
Characterization of Trench MOS Gate Structures Utilizing Photon Emission Microscopy. Microelectron. Reliab. 42(9-11): 1647-1652 (2002)
Coauthor Index
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