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"Thermal simulation of joints with high thermal conductivities for power ..."

Toshitaka Ishizaki et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.04.005

access: closed

type: Journal Article

metadata version: 2022-04-01

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  - https://dblp.org/rec/journals/mr/IshizakiYKSUOY15
Toshitaka Ishizaki, Masashi Yanase, A. Kuno, T. Satoh, Masanori Usui, F. Osawa, Yasushi Yamada:
Thermal simulation of joints with high thermal conductivities for power electronic devices. Microelectron. Reliab. 55(7): 1060-1066 (2015)

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