"Power cycle reliability of Cu nanoparticle joints with mismatched ..."

Toshitaka Ishizaki et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.07.031

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type: Journal Article

metadata version: 2024-10-06

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Toshitaka Ishizaki, Daiki Miura, Atsuki Kuno, Ryota Nagao, Syoho Aoki, Yuta Ohshima, Takuma Kino, Masanori Usui, Yasushi Yamada:
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. Microelectron. Reliab. 64: 287-293 (2016)

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