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Jean Charbonnier
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2020 – today
- 2023
- [c12]Baptiste Jadot, Marcos Zurita, Gérard Billiot, Yvain Thonnart, Loïck Le Guevel, Mathieu Darnas, Candice Thomas, Jean Charbonnier, Tristan Meunier, Maud Vinet, Franck Badets, Gaël Pillonnet:
A Cryogenic Active Router for Qubit Array Biasing from DC to 320 MHz at 100 nm Gate Pitch. ESSCIRC 2023: 157-160 - 2022
- [c11]Jean Charbonnier, Christian Wartena:
Predicting Visible Terms from Image Captions using Concreteness and Distributional Semantics. KDIR 2022: 161-169 - [c10]Heimanu Niebojewski, Benoit Bertrand, Etienne Nowak, Thomas Bedecarrats, Bruna Cardoso Paz, Lauriane Contamin, Pierre-André Mortemousque, V. Labracherie, L. Brevard, H. Sahin, Jean Charbonnier, C. Thomas, Myriam Assous, Mikaël Cassé, Matias Urdampilleta, Yann-Michel Niquet, François Perruchot, Fred Gaillard, Silvano De Franceschi, Tristan Meunier, Maud Vinet:
Specificities of linear Si QD arrays integration and characterization. VLSI Technology and Circuits 2022: 415-416 - 2021
- [j2]Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy:
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56(1): 79-97 (2021) - 2020
- [c9]Yvain Thonnart, Stéphane Bernabé, Jean Charbonnier, Christian Bernard, David Coriat, César Fuguet Tortolero, Pierre Tissier, Benoît Charbonnier, Stéphane Malhouitre, Damien Saint-Patrice, Myriam Assous, Aditya Narayan, Ayse K. Coskun, Denis Dutoit, Pascal Vivet:
POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems. DATE 2020: 1456-1461 - [c8]Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy:
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. ISSCC 2020: 46-48 - [c7]Jean Charbonnier, Christian Wartena:
Predicting the Concreteness of German Words. SwissText/KONVENS 2020
2010 – 2019
- 2019
- [c6]Jean Charbonnier, Christian Wartena:
Predicting Word Concreteness and Imagery. IWCS (1) 2019: 176-187 - 2018
- [c5]Jean Charbonnier, Christian Wartena:
Using Word Embeddings for Unsupervised Acronym Disambiguation. COLING 2018: 2610-2619 - [c4]Frieda Josi, Christian Wartena, Jean Charbonnier:
Text-Based Annotation of Scientific Images Using Wikimedia Categories. DEXA Workshops 2018: 243-253 - [c3]Jean Charbonnier, Lucia Sohmen, John Rothman, Birte Rohden, Christian Wartena:
NOA: A Search Engine for Reusable Scientific Images Beyond the Life Sciences. ECIR 2018: 797-800 - [c2]Lucia Sohmen, Jean Charbonnier, Ina Blümel, Christian Wartena, Lambert Heller:
Figures in Scientific Open Access Publications. TPDL 2018: 220-226 - 2015
- [j1]Jean-Etienne Lorival, Françis Calmon, Fengyuan Sun, Felipe Frantz, Carole Plossu, Martine Le Berre, Ian O'Connor, Olivier Valorge, Jean Charbonnier, David Henry, Christian Gontrand:
An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration. Microelectron. J. 46(2): 153-165 (2015)
2000 – 2009
- 2009
- [c1]David Henry, Séverine Cheramy, Jean Charbonnier, Pascal Chausse, Muriel Neyret, Cathy Brunet-Manquat, Sophie Verrun, Nicolas Sillon, Laurent Bonnot, Xavier Gagnard, E. Saugier:
3D integration technology for set-top box application. 3DIC 2009: 1-7
Coauthor Index
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