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ORCIDKatsuaki Suganuma
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Books and Theses
- 2014
[b1]Katsuaki Suganuma:
Introduction to Printed Electronics. Springer Briefs in Electrical and Computer Engineering, Springer 2014, ISBN 978-1-4614-9624-3, pp. i-vi, 1-124
Journal Articles
- 2018
- [j9]Chanyang Choe
, Seungjun Noh, Chuantong Chen, Dongjin Kim, Katsuaki Suganuma:
Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver. Microelectron. Reliab. 88-90: 695-700 (2018) - [j8]Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li, Katsuaki Suganuma:
Large-area die-attachment by silver stress migration bonding for power device applications. Microelectron. Reliab. 88-90: 701-706 (2018) - [j7]Dongjin Kim, Chuantong Chen, Aiji Suetake, Chanyang Choe, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma:
Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure. Microelectron. Reliab. 88-90: 779-787 (2018) - 2015
- [j6]Katsuaki Suganuma, Jenn-Ming Song, Yi-Shao Lai:
Power electronics packaging. Microelectron. Reliab. 55(12): 2523 (2015) - [j5]Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma:
Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density. Microelectron. Reliab. 55(12): 2554-2559 (2015) - 2012
- [j4]Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto, Katsuaki Suganuma:
Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish. Microelectron. Reliab. 52(11): 2716-2722 (2012) - 2011
- [j3]Kiju Lee, Keun-Soo Kim, Yutaka Tsukada, Katsuaki Suganuma, Kimihiro Yamanaka, Soichi Kuritani, Minoru Ueshima:
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint. Microelectron. Reliab. 51(12): 2290-2297 (2011) - 2007
- [j2]Keun-Soo Kim, Takayuki Imanishi, Katsuaki Suganuma, Minoru Ueshima, Rikiya Kato:
Properties of low temperature Sn-Ag-Bi-In solder systems. Microelectron. Reliab. 47(7): 1113-1119 (2007) - [j1]Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma:
Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system. Microelectron. Reliab. 47(8): 1280-1287 (2007)
Conference and Workshop Papers
- 2014
- [c2]Katsunari Sato, Sayasa Otsubo, Teppei Araki, Tohru Sugahara, Katsuaki Suganuma:
Evaluation of Stretchable Conductor for Measuring Clothing Pressure. EuroHaptics (2) 2014: 191-197 - 2007
- [c1]Yasunori Tada, Masahiro Inoue, Toshimi Kawasaki, Yasushi Kawahito, Hiroshi Ishiguro, Katsuaki Suganuma:
A flexible and stretchable tactile sensor utilizing static electricity. IROS 2007: 684-689
Coauthor Index
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