"Development of thermal shock-resistant of GaN/DBC die-attached module by ..."

Dongjin Kim et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.07.044

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dongjin Kim, Chuantong Chen, Aiji Suetake, Chanyang Choe, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma:
Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure. Microelectron. Reliab. 88-90: 779-787 (2018)

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