"Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low ..."

Takuya Kadoguchi et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.10.003

access: closed

type: Journal Article

metadata version: 2020-12-29

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Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma:
Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density. Microelectron. Reliab. 55(12): 2554-2559 (2015)

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