"Large-area die-attachment by silver stress migration bonding for power ..."

Seungjun Noh et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.07.131

access: closed

type: Journal Article

metadata version: 2025-01-19

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Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li, Katsuaki Suganuma:
Large-area die-attachment by silver stress migration bonding for power device applications. Microelectron. Reliab. 88-90: 701-706 (2018)

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