"TSV-Based 3-D ICs: Design Methods and Tools."

Tiantao Lu et al. (2017)

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DOI: 10.1109/TCAD.2017.2666604

access: closed

type: Journal Article

metadata version: 2022-11-17

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Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava:
TSV-Based 3-D ICs: Design Methods and Tools. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(10): 1593-1619 (2017)

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