"Compact failure modeling for devices subject to electrostatic discharge ..."

Meng Miao et al. (2015)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2014.10.015

access: closed

type: Journal Article

metadata version: 2024-10-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/MiaoZSHL15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/MiaoZSHL15
Meng Miao, Yuanzhong Paul Zhou, Javier A. Salcedo, Jean-Jacques Hajjar, Juin J. Liou:
Compact failure modeling for devices subject to electrostatic discharge stresses - A review pertinent to CMOS reliability simulation. Microelectron. Reliab. 55(1): 15-23 (2015)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.