"Use of signal processing imaging for the study of a 3D package in harsh ..."

Jean Augereau et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.081

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type: Journal Article

metadata version: 2024-10-06

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Jean Augereau, Yves Ousten, Bruno Levrier, Laurent Béchou:
Use of signal processing imaging for the study of a 3D package in harsh environment. Microelectron. Reliab. 46(9-11): 1922-1925 (2006)

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