"3D Chip Stack Technology Using Through-Chip Interconnects."

Peter Benkart et al. (2005)

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DOI: 10.1109/MDT.2005.125

access: closed

type: Journal Article

metadata version: 2020-10-26

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  - https://dblp.org/rec/journals/dt/BenkartKMBPKHHR05
Peter Benkart, Alexander Kaiser, Andreas Munding, Markus Bschorr, Hans-Jörg Pfleiderer, Erhard Kohn, Arne Heittmann, Holger Huebner, Ulrich Ramacher:
3D Chip Stack Technology Using Through-Chip Interconnects. IEEE Des. Test Comput. 22(6): 512-518 (2005)

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