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Andreas Munding

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2005
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Peter Benkart, Alexander Kaiser, Andreas Munding, Markus Bschorr, Hans-Jörg Pfleiderer, Erhard Kohn, Arne Heittmann, Holger Huebner, Ulrich Ramacher:
3D Chip Stack Technology Using Through-Chip Interconnects. IEEE Des. Test Comput. 22(6): 512-518 (2005)

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