"Characterization and Design of 3D-Stacked Memory for Image Signal ..."

Lita Yang et al. (2024)

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DOI: 10.1145/3695794.3695799

access: closed

type: Conference or Workshop Paper

metadata version: 2024-12-16

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  - conf/memsys/YangKSSWLB24
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Lita Yang, Changjung Kao, Sriseshan Srikanth, Huseyin Ekin Sumbul, Tony F. Wu, Huichu Liu, Edith Beigné:
Characterization and Design of 3D-Stacked Memory for Image Signal Processing on AR/VR Devices. MEMSYS 2024: 38-44

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