"Scan test of die logic in 3D ICs using TSV probing."

Brandon Noia et al. (2012)

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DOI: 10.1109/TEST.2012.6401568

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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  - https://dblp.org/rec/conf/itc/NoiaPCL12
Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim:
Scan test of die logic in 3D ICs using TSV probing. ITC 2012: 1-8

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