"Test and debug strategy for TSMC CoWoS™ stacking process based ..."

Sandeep Kumar Goel et al. (2013)

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DOI: 10.1109/TEST.2013.6651893

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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Sandeep Kumar Goel, Saman Adham, Min-Jer Wang, Ji-Jan Chen, Tze-Chiang Huang, Ashok Mehta, Frank Lee, Vivek Chickermane, Brion L. Keller, Thomas Valind, Subhasish Mukherjee, Navdeep Sood, Jeongho Cho, Hayden Hyungdong Lee, Jungi Choi, Sangdoo Kim:
Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study. ITC 2013: 1-10

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