"Interconnect Challenges for 3D Multi-cores: From 3D Network-on-Chip to ..."

Pascal Vivet et al. (2015)

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DOI: 10.1109/ISVLSI.2015.21

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Pascal Vivet, Christian Bernard, Eric Guthmuller, Ivan Miro Panades, Yvain Thonnart, Fabien Clermidy:
Interconnect Challenges for 3D Multi-cores: From 3D Network-on-Chip to Cache Interconnects. ISVLSI 2015: 615-620

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