"A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for ..."

Jie Liao et al. (2023)

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DOI: 10.1109/ISCAS46773.2023.10181990

access: closed

type: Conference or Workshop Paper

metadata version: 2025-02-13

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Jie Liao, Bo Jiao, Jinshan Zhang, Shiwei Liu, Hao Jiang, Jun Tao, Wenning Jiang, Qi Liu, Lihua Zhang, Haozhe Zhu, Chixiao Chen:
A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration. ISCAS 2023: 1-5

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