"Insights into device and material origins and physical mechanisms behind ..."

Milan Pesic et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117898

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-31

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Milan Pesic, Bastien Beltrando, Tommaso Rollo, Cristian Zambelli, Andrea Padovani, Rino Micheloni, Rita Maji, Lisa Enman, Mark Saly, Yang Ho Bae, Jung-Bae Kim, Dong Kil Yim, Luca Larcher:
Insights into device and material origins and physical mechanisms behind cross temperature in 3D NAND. IRPS 2023: 1-8

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