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P. D. Foo

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2003
[j2]
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Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo:
Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectron. J. 34(2): 109-113 (2003)
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Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo:
Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectron. Reliab. 43(8): 1311-1316 (2003)

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