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ORCIDBing Shi 0001
Person information
- affiliation: University of Maryland, Department of Electrical and Computer Engineering, MD, USA
Other persons with the same name
- Bing Shi
- Bing Shi 0002
![[0000-0002-2382-4104]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0002-2382-4104")
— Wuhan University of Technology, School of Computer Science and Artificial Intelligence, Shenzhen Research Institute, China (and 1 more) - Bing Shi 0003 — Harbin Institute of Technology Shenzhen, School of Electronic and Information Engineering, China
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2010 – 2019
- 2014
[j8]Caleb Serafy, Bing Shi, Ankur Srivastava:
A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. Integr. 47(3): 307-317 (2014)- [j7]Bing Shi, Ankur Srivastava:
Optimized Micro-Channel Design for Stacked 3-D-ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(1): 90-100 (2014) - [j6]Yufu Zhang, Bing Shi, Ankur Srivastava:
Statistical Framework for Designing On-Chip Thermal Sensing Infrastructure in Nanoscale Systems. IEEE Trans. Very Large Scale Integr. Syst. 22(2): 270-279 (2014) - 2013
- [j5]Bing Shi, Ankur Srivastava:
Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design. Adv. Comput. 88: 79-124 (2013) - [j4]Bing Shi, Ankur Srivastava, Avram Bar-Cohen:
Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit. IET Circuits Devices Syst. 7(5): 223-231 (2013) - [j3]Bing Shi, Yufu Zhang, Ankur Srivastava:
Dynamic Thermal Management Under Soft Thermal Constraints. IEEE Trans. Very Large Scale Integr. Syst. 21(11): 2045-2054 (2013) - [c12]Caleb Serafy, Bing Shi, Ankur Srivastava, Donald Yeung:
High performance 3D stacked DRAM processor architectures with micro-fluidic cooling. 3DIC 2013: 1-8 - [c11]Caleb Serafy, Bing Shi, Ankur Srivastava:
Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. ACM Great Lakes Symposium on VLSI 2013: 275-280 - [c10]Bing Shi, Ankur Srivastava:
Thermal stress aware 3D-IC statistical static timing analysis. ACM Great Lakes Symposium on VLSI 2013: 281-286 - [c9]Bing Shi, Caleb Serafy, Ankur Srivastava:
Co-optimization of TSV assignment and micro-channel placement for 3D-ICs. ACM Great Lakes Symposium on VLSI 2013: 337-338 - 2012
- [j2]Bing Shi, Yufu Zhang, Ankur Srivastava:
Accelerating Gate Sizing Using Graphics Processing Units. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(1): 160-164 (2012) - [c8]Bing Shi, Ankur Srivastava:
TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs. ISPD 2012: 113-118 - [c7]Bing Shi, Ankur Srivastava, Avram Bar-Cohen:
Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs. ISVLSI 2012: 33-38 - [r1]Bing Shi, Ankur Srivastava:
Thermal and Power-Aware Task Scheduling and Data Placement for Storage Centric Datacenters. Handbook of Energy-Aware and Green Computing 2012: 169-189 - 2011
- [j1]Bing Shi, Ankur Srivastava:
Unified datacenter power management considering on-chip and air temperature constraints. Sustain. Comput. Informatics Syst. 1(2): 91-98 (2011) - [c6]Bing Shi, Ankur Srivastava:
Cooling of 3D-IC using non-uniform micro-channels and sensor based dynamic thermal management. Allerton 2011: 1400-1407 - [c5]Bing Shi, Ankur Srivastava, Peng Wang:
Non-uniform micro-channel design for stacked 3D-ICs. DAC 2011: 658-663 - [c4]Bing Shi, Ankur Srivastava:
Liquid cooling for 3D-ICs. IGCC 2011: 1-6 - 2010
- [c3]Bing Shi, Ankur Srivastava:
Thermal and power-aware task scheduling for Hadoop based storage centric datacenters. Green Computing Conference 2010: 73-83 - [c2]Bing Shi, Yufu Zhang, Ankur Srivastava:
Dynamic thermal management for single and multicore processors under soft thermal constraints. ISLPED 2010: 165-170 - [c1]Yufu Zhang, Bing Shi, Ankur Srivastava:
A statistical framework for designing on-chip thermal sensing infrastructure in nano-scale systems. ISPD 2010: 169-176
Coauthor Index
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