"A geometric approach to chip-scale TSV shield placement for the reduction ..."

Caleb Serafy, Bing Shi, Ankur Srivastava (2014)

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DOI: 10.1016/J.VLSI.2013.11.004

access: closed

type: Journal Article

metadata version: 2021-11-18

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Caleb Serafy, Bing Shi, Ankur Srivastava:
A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. Integr. 47(3): 307-317 (2014)

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