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T. Y. Tee

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Journal Articles

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2010
[j2]
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  - journals/mr/SuTTT10
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Y. A. Su, Long Bin Tan, T. Y. Tee, Vincent B. C. Tan:
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. Microelectron. Reliab. 50(4): 564-576 (2010)
2009
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Z. W. Zhong, T. Y. Tee:
Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs. Proc. IEEE 97(1): 175-183 (2009)

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