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Y. A. Su

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2010 – 2019

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2010
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Y. A. Su, Long Bin Tan, T. Y. Tee, Vincent B. C. Tan:
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. Microelectron. Reliab. 50(4): 564-576 (2010)

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