"Overview of Board-Level Solder Joint Reliability Modeling for Single Die ..."

Z. W. Zhong, T. Y. Tee (2009)

> Home

Details and statistics

DOI: 10.1109/JPROC.2008.2007479

access: closed

type: Journal Article

metadata version: 2020-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/pieee/ZhongT09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/pieee/ZhongT09
Z. W. Zhong, T. Y. Tee:
Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs. Proc. IEEE 97(1): 175-183 (2009)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.