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Jürgen Wolf

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This is just a disambiguation page, and is not intended to be the bibliography of an actual person. The links to all actual bibliographies of persons of the same or a similar name can be found below. Any publication listed on this page has not been assigned to an actual author yet. If you know the true author of one of the publications listed below, you are welcome to contact us.

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2010 – 2019

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2013
[c4]
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Rene Puschmann, Mathias Bottcher, Irene Bartusseck, Frank Windrich, Conny Fiedler, Peggy John, Charles Alix Manier, Kai Zoschke, Jurgen Grafe, Hermann Oppermann, Jürgen Wolf, K. Dieter Lang, Michael Ziesmann:
3D integration of standard integrated circuits. 3DIC 2013: 1-7
2010
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Robert Wieland, Kai Zoschke, Nils Jurgensen, Karl-Reinhard Merkel, Lars Nebrich, Jürgen Wolf:
Silicon-interposer with high density Cu-filled TSVs. 3DIC 2010: 1-4

2000 – 2009

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2009
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Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl:
3-D thin chip integration technology - from technology development to application. 3DIC 2009: 1-8
2008
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Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl:
Technologies for 3D Heterogeneous Integration. CoRR abs/0805.0917 (2008)
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E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, Maik Wiemer:
Through Silicon Vias as Enablers for 3D Systems. CoRR abs/0805.0918 (2008)
2006
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Lars Kaderali, Thomas Zander, Ulrich Faigle, Jürgen Wolf, Joachim L. Schultze, Rainer Schrader:
CASPAR: a hierarchical bayesian approach to predict survival times in cancer from gene expression data. Bioinform. 22(12): 1495-1502 (2006)

1990 – 1999

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1990
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Jonathan Rose, Wolfgang Klebsch, Jürgen Wolf:
Temperature measurement and equilibrium dynamics of simulated annealing placements. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 9(3): 253-259 (1990)

1980 – 1989

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1988
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Jonathan Rose, Wolfgang Klebsch, Jürgen Wolf:
Temperature measurement of simulated annealing placements. ICCAD 1988: 514-517

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