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Michael Toepper

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2000 – 2009

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2009
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  - conf/3dic/FritzschMBTKWWR09
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Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl:
3-D thin chip integration technology - from technology development to application. 3DIC 2009: 1-8
2008
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E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, Maik Wiemer:
Through Silicon Vias as Enablers for 3D Systems. CoRR abs/0805.0918 (2008)

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