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Jong-Ning Aoh

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Journal Articles

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2013
[j2]
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Jong-Ning Aoh, Cheng-Li Chuang, Min-Yi Kang:
Reliability of TCT and HH/HT test performed in chips and flex substrates assembled by thermosonic flip-chip bonding process. Microelectron. Reliab. 53(3): 463-472 (2013)
2006
[j1]
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Cheng-Li Chuang, Jong-Ning Aoh, Rong-Fong Din:
Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process. Microelectron. Reliab. 46(2-4): 449-458 (2006)

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