"Oxidation of copper pads and its influence on the quality of Au/Cu bonds ..."

Cheng-Li Chuang, Jong-Ning Aoh, Rong-Fong Din (2006)

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DOI: 10.1016/J.MICROREL.2005.01.010

access: closed

type: Journal Article

metadata version: 2021-10-14

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Cheng-Li Chuang, Jong-Ning Aoh, Rong-Fong Din:
Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process. Microelectron. Reliab. 46(2-4): 449-458 (2006)

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