"Reliability of TCT and HH/HT test performed in chips and flex substrates ..."

Jong-Ning Aoh, Cheng-Li Chuang, Min-Yi Kang (2013)

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DOI: 10.1016/J.MICROREL.2012.08.026

access: closed

type: Journal Article

metadata version: 2021-10-14

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Jong-Ning Aoh, Cheng-Li Chuang, Min-Yi Kang:
Reliability of TCT and HH/HT test performed in chips and flex substrates assembled by thermosonic flip-chip bonding process. Microelectron. Reliab. 53(3): 463-472 (2013)

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