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ORCIDYi Jin 0004
Person information
- affiliation: Beihang University, Beijing, China
- affiliation: Taizhou University, Taizhou, China
Other persons with the same name
- Yi Jin — disambiguation page
- Yi Jin 0001
![[0000-0001-8408-3816]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0001-8408-3816")
— Beijing Jiaotong University, Beijing, China - Yi Jin 0002 — University of Science and Technology of China, Hefei, China
- Yi Jin 0003 — Xi'an Branch of China Academy of Space Technology, Xi'an, China (and 1 more)
- Yi Jin 0005 — Peking University, Beijing, China
- Yi Jin 0006 — Simon Fraser University, Burnaby, BC, Canada
- Yi Jin 0007 — Fudan University, School of Information Science and Technology, State Key Laboratory of ASIC and System, Shanghai, China
- Yi Jin 0008 — Kennesaw State University, School of Instructional Technology and Innovation, Georgia
- Yi Jin 0009 — Shanghai University, High Performance Computing Center, School of Computer Engineering and Science, China (and 1 more)
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2020 – today
- 2024
[j4]Yi Jin, Qingyuan Zhang:
Cascading Failure Modeling for Circuit Systems Considering Continuous Degradation and Random Shocks Using an Impedance Network. Symmetry 16(4): 488 (2024)- 2023
- [j3]Yi Jin, Qingyuan Zhang, Yunxia Chen, Zhendan Lu, Tianpei Zu:
Cascading failures modeling of electronic circuits with degradation using impedance network. Reliab. Eng. Syst. Saf. 233: 109101 (2023) - [c1]Tianpei Zu, Ze Wang, Yi Jin, Rui Kang:
Belief Reliability Evaluation Method Based on Similar Product Information. ICSRS 2023: 110-115 - 2021
- [j2]Yi Jin, Yunxia Chen, Zhendan Lu, Qingyuan Zhang, Rui Kang:
Cascading Failure Modeling for Circuit Systems Using Impedance Networks: A Current-Flow Redistribution Approach. IEEE Trans. Ind. Electron. 68(1): 632-641 (2021)
2010 – 2019
- 2017
- [j1]Yunxia Chen, Yi Jin, Rui Kang:
Coupling damage and reliability modeling for creep and fatigue of solder joint. Microelectron. Reliab. 75: 233-238 (2017)
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