"Coupling damage and reliability modeling for creep and fatigue of solder ..."

Yunxia Chen, Yi Jin, Rui Kang (2017)

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DOI: 10.1016/J.MICROREL.2017.03.016

access: closed

type: Journal Article

metadata version: 2020-12-18

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Yunxia Chen, Yi Jin, Rui Kang:
Coupling damage and reliability modeling for creep and fatigue of solder joint. Microelectron. Reliab. 75: 233-238 (2017)

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