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Wen-Bin Young

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2010 – 2019

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2018
[j6]
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  - journals/cma/ChenCY18
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Ying-Xuan Chen, Shing-Cheng Chang, Wen-Bin Young:
Application of lattice Boltzmann method in free surface flow simulation of micro injection molding. Comput. Math. Appl. 75(7): 2374-2386 (2018)
2015
[j5]
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Xue-Ru Guo, Wen-Bin Young:
Vacuum effect on the void formation of the molded underfill process in flip chip packaging. Microelectron. Reliab. 55(3-4): 613-622 (2015)
2011
[j4]
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  - journals/mr/ChangY11
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Ching-Ho Chang, Wen-Bin Young:
Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA. Microelectron. Reliab. 51(4): 860-865 (2011)
2010
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Wen-Bin Young:
Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation. Microelectron. Reliab. 50(7): 995-999 (2010)

2000 – 2009

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2009
[j2]
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Meng-Fu Shih, Wen-Bin Young:
Experimental study of filling behaviors in the underfill encapsulation of a flip-chip. Microelectron. Reliab. 49(12): 1555-1562 (2009)
2003
[j1]
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Wen-Bin Young:
Anisotropic behavior of the capillary action in flip chip underfill. Microelectron. J. 34(11): 1031-1036 (2003)

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